Applied to high-precision attachment of protective film and shipping film on the surface of PCB substrates in Mini LED backlight PCB substrate process.
On-line equipment, compatible with 12/14/16 inch protective film stacked loading.
The angle of tear-off path and film peel-off can be adjusted with a range of 0-55 degrees.
The high-precision air pressure adjustment, combined with high-precision pressure monitoring, providing real-time control of the film-attaching pressure.
High-precision CCD vision error compensation.
Automatic scanning and uploading of production data to monitor the production status throughout the process, with one-click production report generation and docking with MES.
UPH : 210
Film attachment accuracy : ±0.2 mm
Meet Class 100 cleanroom standards.
| project | Specification Description |
|---|---|
| Input Voltage | AC 220V 50HZ |
| Power | 5 Kw |
| Air Pressure | 0.5~0.7MPa |
| Dimension | 1800(L) x 2000(W) x 2200(H) mm |
| Weight | 950kg |
| Environmental Temperature | 22±5°C |
| Cleanliness Level | Class 1000 |
| Cycle Time | 18s |
| UPH | 192 |
| Yield | 99% |
