Suitable for package sorting and cleaning after sputter process. It can peel off the products from the adhesive film, clean the sputter burrs, and then transfer them to the standard JEDEC tray.
Tape Frame to JEDEC Tray sorting, applicable to bare chips or IC package sorting.
High-speed turret pick-and-place structure, with multi-steps function that can work in parallel, achieving high efficiency and high throughput.
Deburr function is available, using ESD static electricity brushes for cleaning and ion to blow away burrs, and equipped with dust collection mechanism.
Compatible with magazine and frame input, suitable for online or offline use with customers.
High UPH: ≥8K (based on package size 3x3mm ).
Multiple sets of top needle mechanism: three-stage top, film scraper, integrated top needle holder.
| project | Specification Description |
|---|---|
| UPH | 8 K (based on package size 3x3 mm ) |
| Frame Size | 8~12 inch |
| Output | Tray Stack |
| Package Size | 1x1mm~15x15 mm |
| Package Thickness | 0.1~3 mm |
| Placement Accuracy | ±50 μm |
| Number of PnP Heads | 24 |
| Cleaning Module | 3 sets of ESD brushes |
| Vision Module | 3 sets |
| Dimension | 2000(L) x 1900(W) x 2100(H) mm |
