Suitable for IC assembly and sputtering process, and can be used for UV tape detaping process, UV tape viscosity removal and other processes of optical lenses, filters, LEDs, integrated circuit boards and other semiconductor materials.
Uses LED light to irradiate for tape debonding
Compatible with magazine and cassette loading and unloading
No preheating required and power adjustable for different light intensity requirements
Wide range of applications, does not affect the temperature and thermal deformation of the debonding area
UV irradiation power and time are adjustable
Applicable to 3000mj/cm2, irradiation time ≤10s
Supports SECS/GEM protocol : SEMI E5, E30, E37, E37.1, E142.
| project | Specification Description |
|---|---|
| UV Energy | >3000mj/cm2 |
| Wavelength | 365mn |
| Irradiation Temperature | <60℃ |
| Supported Irradiation Range | 250*250mm |
| SECS/GEM Protocol | SEMI E5、 E30、 E37、 E37.1、 E142 |
| Dimension | 1100*550*1750mm |
