Suitable for ECONO DUAL3 packaging, it mainly includes side frame feeding, side frame marking, substrate dispensing, side frame substrate assembly, online heating and curing process.
Excellent production capacity: Econo series <20s/module
Accurate positioning: positioning accuracy up to 0.05mm
Dispensing system: glue volume±10% with Cmk >2
Dispensing range: X/Y position±0.2mm
3D inspection for path, position, glue width, glue height, broken glue
Heating and curing: heating temperature range from room temperature ~ 200℃ with accuracy of within ±1℃
Temperature uniformity: unloaded within±3℃ (measured at five points), loaded within±5℃ (measured at five points)
MENS system : integration with factory MES, automatic formula recipe, and process parameter uploading to MES system
Modular design : easy to upgrade according to customer’s requests
| project | Specification Description |
|---|---|
| UPH | Econo series <20 sec/module |
| Gluing system | 0.1mm |
| Bar Code Reading error rate | ＜0.01% |
| Repeat Positioning Accuracy | ＜0.05mm |
| CCD Positioning Accuracy | 0.014mm |
| Equipment Operating Noise Continuous | Continuous noise ≤70dB(A) (measured at a distance of 1.5m from the equipment) |
| Equipment Stability and Reliability | MTBF≥168h, MTTR≤20mins, MTBA≥3h, MTTA≤3 mins |
| Failure Rate | ＜2% |
| Cmk | ＞1.67 |
| Supported Functions Operation | Operation authority management, communication with the machine and compliance with SMEMA standards, interface types should meet Secs/Gem and other types, to achieve product traceability requirements. |
