Suitable for ECONO series, HPD packaging, it mainly including DBC mounting, reflow soldering, positioning frame disassembly, cleaning, X-Ray, housing glue dispensing, room temperature aging cabinet bonding and cleaning, vacuum potting, high temperature curing furnace, and housing packaging and unloading.
High productivity : Econo series <20s/module, HPD/HP1 <30s/module.
Accurate positioning : positioning accuracy up to 0.02mm
Automation rate >90%, saving 12 workers per shift, only two personnel online responsible for bond inspection
Dispensing system : glue volume: ±10% with Cmk >2
Dispensing range : X/Y position:±0.2mm; 3D detection trajectory and break detection
Potting curing: online dual pipeline potting, high production efficiency
Wire bonding automation : 12 wire bonders are connected to the main line as support
Customized design such as cleaning baskets, DBC positioning frames, bonding fixtures and other production auxiliary tools meet various requirements
Module design : easy to upgrade according to customer request
| project | Specification Description |
|---|---|
| UPH | Econo series <20 s/module, HPD/HP1 < 30 s/module |
| DBC mounting Accuracy | 0.05mm |
| Bar Code Reading error rate | ＜0.01% |
| Repeat Positioning Accuracy | ＜0.05mm |
| CCD Positioning Accuracy | 0.014mm |
| Servo Press | Pressing stroke : 200mm；Pressing force : 3T; Pressing speed：0-200mm/s |
| Glue Mixing Method | Static mixing tube |
| Equipment Operating Noise | Continuous noise ≤70dB(A) (measured at a distance of 1.5m from the equipment) |
| Equipment Stability and Reliability | MTBF≥168h, MTTR≤20mins, MTBA≥3h, MTTA≤3mins |
| Failure Rate | ＜2% |
| Cmk | ＞1.67 |
| Supporting Functions | Operation authority management, communication with the machine and compliance with SMEMA standards, interface types should meet Secs/Gem and other types, to achieve product traceability requirements. |
